Keyphrases
Microstructure
100%
Soldering
100%
Joint Effect
100%
Solder Joint
100%
Strain Energy Release Rate
100%
R-curve Behavior
100%
Moderatio
100%
Ag3Sn
100%
Microelectronics
50%
Loading Conditions
50%
Steady-state Value
50%
Double Cantilever Beam Specimen
50%
Intermetallics
50%
Cooling Rate
50%
Relative Amount
50%
R-curve
50%
Mixed Mode Loading
50%
Intermetallic Compound Layer
50%
Liquidus
50%
Time-temperature Profile
50%
Mode II Loading
50%
Local Geometry
50%
Solder Layer
50%
Engineering
Joints (Structural Components)
100%
Microstructure
100%
Intermetallics
100%
Strain-Energy Release Rate
100%
R-Curves
100%
Curve Behavior
100%
Mode Ratio
100%
Microelectronics
50%
Loading Condition
50%
Double-Cantilever Beam
50%
Beam Specimen
50%
Temperature Profile
50%
Mixed Mode
50%
Relative Amount
50%
Cooling Rate
50%
Compound Layer
50%