Reflow Mechanisms of Contact Vias in VLSI Processing

Keyphrases

• Overhang 100%
• Reflow 100%
• Glass Thickness 60%
• Sidewall 40%
• Low Temperature 20%
• Closely Spaced 20%
• Chemical Nature 20%
• Bulge 20%
• Processing Parameters 20%
• Glass Substrate 20%
• Idealized Geometry 20%
• Substrate Interface 20%
• Borophosphosilicate Glass 20%
• Glass Reflow 20%
• Re-entrant 20%
• Case Closure 20%
• All-glass 20%

Engineering

• Side Wall 100%
• Extreme Case 100%
• Low-Temperature 50%
• Processing Parameter 50%
• Glass Substrate 50%
• Substrate Interface 50%
• Intermediate Stage 50%