Abstract
We have investigated the reliability of gate oxide with deuterium incorporated at the Si/SiO2 interface through low energy ion implantation into the silicon substrate before thin gate oxide growth. Deuterium implantation at a dose of 1 × 1014/cm2 at 25 keV showed improved breakdown characteristics. Charge-to-breakdown seems to correlate well with the interface state density measured by conductance method.
Original language | English (US) |
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Pages (from-to) | 1015-1016 |
Number of pages | 2 |
Journal | IEEE Transactions on Electron Devices |
Volume | 48 |
Issue number | 5 |
DOIs | |
State | Published - May 2001 |
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering