Selective Electroless Plated Ni Contacts to CMOS Junctions with CoSi₂

Keyphrases

• Metal Oxide 100%
• CoSi2 100%
• Electroless 100%
• Silicon Junction 100%
• Al-Ni 83%
• Diode 33%
• Metallization 33%
• Physical Analysis 33%
• Deep Junction 33%
• NiSi 33%
• High Aspect Ratio 16%
• Electrical Properties 16%
• Silicon Processing 16%
• Material Interaction 16%
• Annealing 16%
• Contact Resistance 16%
• Annealing Temperature 16%
• Silicon Devices 16%
• Transmission Electron Microscopy 16%
• Microscopy Electron 16%
• Auger Electron Spectroscopy 16%
• Processing Temperature 16%
• Nickel Alloys 16%
• Electroless Plating 16%
• Electroless Ni-P 16%
• Al3Ni 16%
• Ni Metallization 16%
• Al-Si 16%
• Ni2Si 16%
• Ultra-shallow Junction 16%
• Reverse Bias 16%

Engineering

• Metallizations 100%
• Silicon Oxide 100%
• High Aspect Ratio 33%
• Alloy 33%
• Silicon Device 33%
• Reverse Bias 33%
• Plating Process 33%
• Material Interaction 33%
• Cross-Section Analysis 33%
• Electroless Plating 33%
• Aluminum 33%

Material Science

• Silicon 100%
• Metal Oxide 100%
• Transmission Electron Microscopy 33%
• Aluminum 33%
• Contact Resistance 33%
• Electroless Deposition 33%
• Auger Electron Spectroscopy 33%
• Electrical Property 33%
• Silicon Device 33%
• Nickel Alloy 33%