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Sequential 3D IC fabrication-Challenges and prospects
Bipin Rajendran
Research output
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Contribution to conference
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Paper
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peer-review
8
Scopus citations
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Dive into the research topics of 'Sequential 3D IC fabrication-Challenges and prospects'. Together they form a unique fingerprint.
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Keyphrases
3D IC
100%
IC Manufacturing
100%
Sequential 3D
100%
Fabrication Challenges
100%
Low Thermal Budget
50%
CMOS Devices
50%
Chemical Vapor Deposition Technique
50%
Pulsed Laser Annealing
50%
Crystalline Template
50%
Engineering
Pulsed Laser
100%
Chemical Vapor Deposition
100%
Vapor Deposition
100%
Interlayer
100%
Three Dimensional Integrated Circuits
100%
Material Science
Electronic Circuit
100%
Crystalline Material
100%
Annealing
100%
Chemical Vapor Deposition
100%
Chemical Engineering
Chemical Vapor Deposition
100%
Vapor Deposition
100%