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Simulation of the mold‐filling process
P. ‐C Wu, C. F. Huang,
C. G. Gogos
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peer-review
67
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Keyphrases
Velocity Field
100%
Non-isothermal
100%
Temperature Field
100%
Filling Process
100%
Polystyrene
100%
Surface Layer
100%
Nylon 6
100%
Power-law Fluid
100%
Transport Equation
100%
Filling Time
100%
Linear Polyethylene
100%
Rigid PVC
100%
Short Shot
100%
Engineering
Transients
100%
Specifies
100%
Temperature Field
100%
Velocity Field
100%
Filling Process
100%
Power Law Fluid
100%
Surface Layer
100%
Linear Polyethylene
100%
Chemical Engineering
Temperature Distribution
100%
Polyvinyl Chloride
100%
Polystyrene
100%
Material Science
Polyethylene
100%
Polystyrene
100%
Polyvinyl Chloride
100%