The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Sudhakar Shet, Vishal R. Mehta, Anthony T. Fiory, Martin P. Lepselter, N. M. Ravindra

Research output: Contribution to journalArticlepeer-review

25 Scopus citations

Abstract

Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.

Original languageEnglish (US)
Pages (from-to)32-34
Number of pages3
JournalJOM
Volume56
Issue number10
DOIs
StatePublished - Oct 2004

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

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