The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Sudhakar Shet; Vishal R. Mehta; Anthony T. Fiory; Martin P. Lepselter; N. M. Ravindra

doi:10.1007/s11837-004-0286-0

The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Sudhakar Shet, Vishal R. Mehta, Anthony T. Fiory, Martin P. Lepselter, N. M. Ravindra

Physics

Research output: Contribution to journal › Article › peer-review

28 Scopus citations

Abstract

Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.

Original language	English (US)
Pages (from-to)	32-34
Number of pages	3
Journal	JOM
Volume	56
Issue number	10
DOIs	https://doi.org/10.1007/s11837-004-0286-0
State	Published - Oct 2004

All Science Journal Classification (ASJC) codes

General Materials Science
General Engineering

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abstract = "Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.",

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AU - Lepselter, Martin P.

AU - Ravindra, N. M.

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AB - Magnetic field-assisted assembly is an integration technique for the efficient placement of a large number of nanodevices into receptor sites etched in semiconductor wafers with or without circuitry. The diverging flux from a magnetic field source helps in attaching heterostructure nanodevices into wafers. Various approaches of magnetic field-assisted assembly using air pressure, vibration assistance, fluid, and feed tape are briefly explained in this article. Magnetic field-assisted assembly is anticipated to become a manufacturing approach that will be driven by its simplicity and promise of high yield at low cost.

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The magnetic field-assisted assembly of nanoscale semiconductor devices: A new technique

Abstract

All Science Journal Classification (ASJC) codes

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