Keyphrases
Shallow Junction
100%
Submicron
100%
Line Resistance
100%
TiSi2
100%
Thermal Stability Limit
100%
Junction Leakage
100%
Poly-Si
50%
Thermal Stability
33%
Annealing
25%
Diode
16%
Silicide
16%
Agglomeration
8%
Ultra-shallow Junction
8%
Microstructure
8%
Scanning Electron Microscopy
8%
Si-doped
8%
Rutherford Backscattering Spectrometry
8%
Thermal Process
8%
Transmission Electron Microscopy
8%
Dopant Type
8%
Doping Concentration
8%
Sheet Resistance
8%
Low Resistivity
8%
Sintering Process
8%
Gate Height
8%
Process Cycles
8%
Self-aligned
8%
Electron Beam Scanning
8%
Reverse Bias
8%
Salicide
8%
Junction Depth
8%
Meander Line
8%
Gate Work Function
8%
Engineering
Shallower
100%
Shallow Junction
100%
Line Resistance
100%
Transmissions
50%
Dopants
50%
Microstructure
50%
Sheet Resistance
50%
Thermal Process
50%
Reverse Bias
50%
Junction Depth
50%
Sintering Process
50%
Earth and Planetary Sciences
Thermal Stability
100%
Silicide
40%
Scanning Electron Microscopy
20%
Transmission Electron Microscopy
20%
Sintering
20%
Backscattering
20%
Work Function
20%
Material Science
Thermal Stability
100%
Silicide
40%
Scanning Electron Microscopy
20%
Transmission Electron Microscopy
20%
Electrical Resistivity
20%
Doping (Additives)
20%
Sintering
20%