Transient-enhanced diffusion in shallow-junction formation

Shallow junctions are formed in crystalline Si by low-energy ion implantation of B⁺, P⁺, or As⁺ species accompanied by electrical activation of dopants by rapid thermal annealing and the special case of spike annealing. Diffusion depths were determined by secondary ion-mass spectroscopy (SIMS). Electrical activation was characterized by sheet resistance, Hall coefficient, and reverse-bias diode-leakage measurements. The B⁺ and P⁺ species exhibit transient-enhanced diffusion (TED) caused by transient excess populations of Si interstitials. The electrically activated fraction of implanted dopants depends mainly on the temperature for B⁺ species, while for P⁺ species, it depends on both temperature and P⁺ dose. The relatively small amount of diffusion associated with As⁺ implants is favorable for shallow-junction formation with spike annealing.