Abstract
Individual processing steps have been varied to determine the effect of Schottky barrier solar cell (SBSC) performance. A 100 direction Si wafer produces a better fill factor and current than does 111 direction Si. Silicon resistivity of 0. 4 or 2 omega -cm results in comparable cells. Sputter deposition of the metal causes the metal atoms to penetrate the silicon which produces a lower voltage as a result of a reduced barrier height. I-V data suggest the presence of a tunneling component in the current. This is verified by an activation energy plot. A better understanding of these current mechanisms should lead to improved solar cell efficiency.
Original language | English (US) |
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Pages | 217-220 |
Number of pages | 4 |
DOIs | |
State | Published - 1975 |
Externally published | Yes |
Event | Int Electron Devices Meet, Tech Dig - Washington, DC, USA Duration: Dec 1 1975 → Dec 3 1975 |
Other
Other | Int Electron Devices Meet, Tech Dig |
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City | Washington, DC, USA |
Period | 12/1/75 → 12/3/75 |
All Science Journal Classification (ASJC) codes
- General Engineering