Vibration cancellation of semiconductor manufacturing robots

Zining Wang, Cong Wang, Masayoshi Tomizuka

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

The semiconductor manufacturing industry is having a critical upgrade. To meet the new standards of silicon wafer production and processing, vibration control of wafer handling robots must break new grounds because conventional methods have reached their limits. This paper presents a direct vibration cancellation method for semiconductor manufacturing robots. With a vibrotactile transducer on the wafer holder, the vibration can be significantly reduced without adversely affecting the tracking accuracy of the wafer handling motion. Several control strategies are analyzed and combined to obtain the best performance. Experimental validation shows a vibration reduction of 47% in energy and 30% in amplitude.

Original languageEnglish (US)
Pages (from-to)6-9
Number of pages4
JournalManufacturing Letters
Volume4
DOIs
StatePublished - Apr 1 2015
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Industrial and Manufacturing Engineering

Keywords

  • Semiconductor manufacturing
  • Vibration cancellation
  • Wafer handling robots

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