Vibration cancellation of semiconductor manufacturing robots

Zining Wang; Cong Wang; Masayoshi Tomizuka

doi:10.1016/j.mfglet.2015.01.004

Vibration cancellation of semiconductor manufacturing robots

Zining Wang, Cong Wang, Masayoshi Tomizuka

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

The semiconductor manufacturing industry is having a critical upgrade. To meet the new standards of silicon wafer production and processing, vibration control of wafer handling robots must break new grounds because conventional methods have reached their limits. This paper presents a direct vibration cancellation method for semiconductor manufacturing robots. With a vibrotactile transducer on the wafer holder, the vibration can be significantly reduced without adversely affecting the tracking accuracy of the wafer handling motion. Several control strategies are analyzed and combined to obtain the best performance. Experimental validation shows a vibration reduction of 47% in energy and 30% in amplitude.

Original language	English (US)
Pages (from-to)	6-9
Number of pages	4
Journal	Manufacturing Letters
Volume	4
DOIs	https://doi.org/10.1016/j.mfglet.2015.01.004
State	Published - Apr 1 2015
Externally published	Yes

All Science Journal Classification (ASJC) codes

Mechanics of Materials
Industrial and Manufacturing Engineering

Keywords

Semiconductor manufacturing
Vibration cancellation
Wafer handling robots

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10.1016/j.mfglet.2015.01.004

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title = "Vibration cancellation of semiconductor manufacturing robots",

abstract = "The semiconductor manufacturing industry is having a critical upgrade. To meet the new standards of silicon wafer production and processing, vibration control of wafer handling robots must break new grounds because conventional methods have reached their limits. This paper presents a direct vibration cancellation method for semiconductor manufacturing robots. With a vibrotactile transducer on the wafer holder, the vibration can be significantly reduced without adversely affecting the tracking accuracy of the wafer handling motion. Several control strategies are analyzed and combined to obtain the best performance. Experimental validation shows a vibration reduction of 47% in energy and 30% in amplitude.",

keywords = "Semiconductor manufacturing, Vibration cancellation, Wafer handling robots",

author = "Zining Wang and Cong Wang and Masayoshi Tomizuka",

note = "Publisher Copyright: {\textcopyright} 2015 Society of Manufacturing Engineers (SME).",

year = "2015",

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doi = "10.1016/j.mfglet.2015.01.004",

language = "English (US)",

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T1 - Vibration cancellation of semiconductor manufacturing robots

AU - Wang, Zining

AU - Wang, Cong

AU - Tomizuka, Masayoshi

PY - 2015/4/1

Y1 - 2015/4/1

N2 - The semiconductor manufacturing industry is having a critical upgrade. To meet the new standards of silicon wafer production and processing, vibration control of wafer handling robots must break new grounds because conventional methods have reached their limits. This paper presents a direct vibration cancellation method for semiconductor manufacturing robots. With a vibrotactile transducer on the wafer holder, the vibration can be significantly reduced without adversely affecting the tracking accuracy of the wafer handling motion. Several control strategies are analyzed and combined to obtain the best performance. Experimental validation shows a vibration reduction of 47% in energy and 30% in amplitude.

AB - The semiconductor manufacturing industry is having a critical upgrade. To meet the new standards of silicon wafer production and processing, vibration control of wafer handling robots must break new grounds because conventional methods have reached their limits. This paper presents a direct vibration cancellation method for semiconductor manufacturing robots. With a vibrotactile transducer on the wafer holder, the vibration can be significantly reduced without adversely affecting the tracking accuracy of the wafer handling motion. Several control strategies are analyzed and combined to obtain the best performance. Experimental validation shows a vibration reduction of 47% in energy and 30% in amplitude.

KW - Semiconductor manufacturing

KW - Vibration cancellation

KW - Wafer handling robots

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VL - 4

SP - 6

EP - 9

JO - Manufacturing Letters

JF - Manufacturing Letters

ER -

Vibration cancellation of semiconductor manufacturing robots

Abstract

All Science Journal Classification (ASJC) codes

Keywords

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